HQ / Seoul
+82-2-2082-5420
Overview
- It is a new concept thermal pad that is attached between a heat source such as CPU, GPU, etc. and a heat sink, and has both the function of conducting heat and reducing electromagnetic noise generated from the heat source.
- Attenuates electromagnetic noise generated from high-speed processing components such as CPU and GPU using the dielectric loss effect.
- The noise attenuation effect is significant between 400MHz/700MHz and 10GHz frequency band.
Features
- Solve heat and electromagnetic noise problems in high-speed computing devices at the same time.
- Made of silicone resin, it has excellent adhesion to heat sources and has a high heat conduction effect.
- Lightweight and low price compared to existing products using magnetic materials.
- It can be processed into various shapes depending on the purpose.
- Excellent heat resistance and flame retardancy. (Up to 150℃)
- RoHS Compliant, Halogen-free, UL94-V0
Details
| Unit | TH933S-70-26-OO-BT | TH931S-70-30-OO-BT | TH936S-70-30-OO-BT | TH937S-75-40-OO-BT | Remarks | |
|---|---|---|---|---|---|---|
| Thermal Conductivity | W/mK | 2.6 | 3.0 | 3.0 | 4.0 | ASTM D 5470 |
| Hardness | Shore 00 | 70 ±10 | 70 ±10 | 70 ±10 | 75 ±10 | ASTM D 2240 |
| Density | g/㎤ | 2.55 | 2.40 | 2.90 | 2.53 | ASTM D 792 |
| Surface Resistance | Ω/□ | 1*108 | 1*108 | 1*108 | 1*108 | ASTM D 149 |
| Flame Rating | - | V-0 | UL94 | |||
| Operating Temp. | ℃ | -40 ~ 150 | - | |||
| Standard Size | mm | 210 x 300 / 300 x 300 | - | |||
| Standard Thickness | mm | 1.0 ~ 5.0 | - | |||
Noise attenuation frequency band
* Based on thickness of 1mm
| P/N | Thermal Conductivity (W/mK) |
Effective Frequency Band |
|---|---|---|
| TH933S-70-26-OO-BT | 2.6 | 400MHz ~ 10GHz |
| TH931S-70-30-OO-BT | 3.0 | 700MHz ~ 10GHz |
| TH936S-70-30-OO-BT | 3.0 | 400MHz ~ 10GHz |
| TH937S-75-40-OO-BT | 4.0 | 700MHz ~ 10GHz |
Applications
- Attached between a heat source such as CPU or GPU and a heat sink / shield can, it performs both heat conduction and electromagnetic noise attenuation functions.
- It is soft and has good adhesion, so it can be detached and semi-fixed, making it easy to work with.
- Recommended for use in high-performance PCs, data center servers, laptops, and vehicle displays.
Product Support
Product Code
| Number | Code | Examples |
|---|---|---|
| (1) | Product Line | TH (Thermal Interface Material)) |
| (2) | Serial Number | 931, 933, 936, 937 |
| (3) | Material | S: Silicone |
| (4) | Hardness | 70 |
| (5) | Thermal Conductivity | 30: 3.0W/mK, 26: 2.6W/mK |
| (6) | Base Material | OO: None |
| (7) | Surface Viscosity | BT: Both side |
Documentation
No data.