Thermal Foam Gasket (TFG)
Thermal Foam Gasket(TFG) is a thermally conductive foam gasket with a graphite surface with excellent horizontal thermal conductivity.
Thermal Interface Material
Commonly used thermal interface material, silicone thermal pad, is an adequate material to attach between chip sets or PCB plates and the radiator. Silicone thermal pad has excellent adhesiveness and softness due to silicone's property, which effectively reduces the air gap. However, the thermal conductivity is not very good because it is made by adding thermally conductive ceramic powder to silicon, an insulating material. The silicone thermal pad thermal conductivity is only 1-5W/mK, while those of copper and aluminum are 385 and 205 W/mK. Making the pad thin enough solves the conductivity issue to some extent, which still allows it to be popular in the market.
Silicone Thermal Pad
Silicone Thermal conductive pad is a typical thermal interface material that effectively conducts heat generated from heat sources inside electronic devices and automobiles.
Silicone Thermal Sheet
Thermal conductive sheet is an ultra-thin thermal interface material in the form of a thin film, which is produced by dispersing and mixing the thermally conductive powder in silicone resin.
Conductive TFG
Conductive TFG is a product that has excellent heat dissipation (heat conduction) function and electromagnetic noise attenuation function by wrapping electrically conductive fabric to the existing thermal foam gasket.