Reliability Test

Scanning Electron Microscopy (SEM)

SEM analyzes the surface of sample through secondary electrons or reflection electrons generated from the sample by scanning electron beam on the surface of the sample.

It is possible to measure the shape and particle size of the surface of the sample.

Energy Dispersive X-Ray Spectroscopy (EDS)

EDS conducts elemental and quantitative analysis of sample products from Element No. 5 B (Boron) to 98 Cf (Californium).

• Multilayer thin film thickness measurement (maximum 5 layers)
• Analysis of hazardous materials (Cr, Br, Cd, Hg, Pb, Cl, Sb, Sn, S, etc.) for RoHS, WEEE and ELV
• Measurement range: Ti (22) to U (92)
• Sample form: solid / liquid / powder

※ Measurement principle

X-ray fluorescence (XRF) is the emission of characteristic "secondary" (or fluorescent) X-rays from a material that has been excited by being bombarded with high-energy X-rays or gamma rays. The phenomenon is widely used for elemental analysis and chemical analysis, particularly in the investigation of metals, glass, ceramics and building materials.

When materials are exposed to short-wavelength X-rays or to gamma rays, ionization of their component atoms may take place. Ionization consists of the ejection of one or more electrons from the atom, and may occur if the atom is exposed to radiation with an energy greater than its ionization energy. X-rays and gamma rays can be energetic enough to expel tightly held electrons from the inner orbitals of the atom. The removal of an electron in this way makes the electronic structure of the atom unstable, and electrons in higher orbitals "fall" into the lower orbital to fill the hole left behind. In falling, energy is released in the form of a photon, the energy of which is equal to the energy difference of the two orbitals involved. Thus, the material emits radiation, which has energy characteristic of the atoms present. The term fluorescence is applied to phenomena in which the absorption of radiation of a specific energy results in the re-emission of radiation of a different energy (generally lower).

* Source : wikipedia.org

Test method

Insert sample between electrode plates. Press the upper plate down, measuring vertical resistance, force and pressing rate simultaneously. Load and other settings are set to match the samples size and type.

Test object

Thick and flexible products such as fabric over foam and fingerstock

Test sample size : 1.0mm ~ 30mm think and 50mm long

Test method

Insert sample sheet (O.D. 130mm, I.D. 70mm) into the shielded chamber and measure S.E. with network analyzer. Insert sample sheet (O.D. 130mm) and measure S.E. Compare the results and calculate shielding effectiveness.

Test object

Products which is less than 2mm thick such as conductive fabric, conductive mesh, conductive film and conductive tape

Test method

The same method as MIL MIL DTL-83528C. Low frequency test available (from 10KHz)

Test object

Conductive mesh, conductive film, conductive thin sheet, military-used shielding material

Test method

For measuring wide range frequency

Test object

Fabric over foam, fingerstock, wire mesh gasket, bigger product

Test method

Test object

Conductive fabric, conductive non-woven, conductive adhesive tape, conductive thin sheet

Test method

Put down the sample on the insulation plate and put electrode on the center of sample and measure resistance

Test object

Products which is electrically conductive itself such as conductive silicone elastomer and conductive foam

Test method

This is to test its life cycle concerning restoration. put the sample on the lower die and compress cycle/sec to 30% of its free standing height

Test object

Products where recovery rate is important, such as fabric over foam gaskets and fingerstock

Test method

Put the sample in the center of Helmholtz coil and generate alternative magnetic field to sample. Magnetic shielding effectiveness(S) is expressed as below formula which means the difference between the strength(Be) of magnetic field measured without shielding material and the strength(Bi) measured covered.

Test object

Products which has permeability such as permalloy foil, MAGshiel foil, Si-steel. etc.

• Thermal Conductivity Measurement: 0.1W/mK ~ 100W/mK
• Thermal resistance measuring range: 0.01K/W ~ 8K/W
• Measurable material: Solid, Powder, Liquid
• Measurable thickness: 50㎛ ~ 20mm
• Measuring pressure: 10psi ~ 150psi (Possible to measure thickness and thermal resistance of specimen under pressure changes)

Principle of operation

This thermal conductivity measuring instrument can measure the thermal conductivity of various materials by using the thermal equilibrium method according to US ASTM-D5470 standard. This apparatus is based on the determination of the thermal conductivity of the specimen at the moment when the heat quantity in the upper and lower parts becomes equilibrium.

• Usage:

Evaluation and measurement of wettability of solder on electronic parts

Measures wetting time, wetting force, contact angle and surface tension

• Specification: penetration depth 0.01 ~ 20.0mm
• Penetration rate: 0.1 ~ 30.0mm / sec
• Dimensions: 467 (W) * 475 (D) * 556 (H) mm
• Pressure sensitivity: 50mN full-scale
• Bath temperature: 245℃ ± 2℃, PID control

Principle of operation

The sample is hung on the arm of the electronic balance and automatically penetrates into the solder melted up to the set depth by the set speed. At this time, the molten lead is adsorbed on the surface of the electronic component according to the interfacial tension acting on the surface of the electronic component lead, and forms a contact angle. This change is transferred to the electronic balance hanging from the electronic component sample, and by measuring the transferred force, it is possible to continuously obtain changes in the adsorption force and contact angle of the molten lead over time. From this information, various data such as wetting, contact angle, and surface tension are calculated by a computer using a data processing program.

Test method

It is one of reliability tests. Raise the temperature and humidity rapidly to sample and keep for some time. Observe its shape, conductivity, adhesion, restoration and compare with initial status. The test conditions, time, temperature, humidity are matched to tye to the size and type of the test sample.