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Reliability Test

Our R&D center and QC conduct reliability testing regularly to provide more stable quality products to customers.

The reliability tests that we mainly carry out are as follows.


SEM/EDS

XRF (X-ray Fluorescence)

Resistance Compression Test

EMI Shielding Performance Test

Surface Resistance Test

Volume Resistance Test

Compression Recovery Test

Magnetic Shielding Performance Test

Thermal Conductivity Test

Lead wettability measurement

Ageing Test

Plating Adhesion Strength Test


SEM/EDS

EMI-Test-Equipment-1
Scanning Electron Microscopy (SEM)

SEM analyzes the sample's surface through secondary electrons or reflection electrons generated from the sample by scanning an electron beam on the sample's surface.

It is possible to measure the shape and particle size of the sample's surface.


Energy Dispersive X-Ray Spectroscopy (EDS)

EDS conducts an elemental and quantitative analysis of sample products from Element No. 5 B (Boron) to 98 Cf (Californium).


SEM Image Sample
  • SEM Image for EMI solution
  • SEM Image for EMI solution
  • SEM Image for EMI solution
EDS Image Sample
EDS Image Sample



XRF (X-ray Fluorescence)

EMI-Test-Equipment-1
  • Measurement of the thickness of thin film multilayer(up to 5 layers)
  • Analysis of hazardous materials (Cr, Br, Cd, Hg, Pb, Cl, Sb, Sn, S, etc.) for RoHS, WEEE and ELV
  • Measurement range: Ti (22) to U (92)
  • Sample form: solid / liquid / powder

※ Measurement principle

X-ray fluorescence (XRF) is the emission of characteristic "secondary" (or fluorescent) X-rays from a material that has been excited by being bombarded with high-energy X-rays or gamma rays. The phenomenon is widely used for elemental analysis and chemical analysis, particularly in the investigation of metals, glass, ceramics and building materials.

When materials are exposed to short-wavelength X-rays or to gamma rays, ionization of their component atoms may take place. Ionization consists of the ejection of one or more electrons from the atom, and may occur if the atom is exposed to radiation with an energy greater than its ionization energy. X-rays and gamma rays can be energetic enough to expel tightly held electrons from the inner orbitals of the atom. The removal of an electron in this way makes the electronic structure of the atom unstable, and electrons in higher orbitals "fall" into the lower orbital to fill the hole left behind. In falling, energy is released in the form of a photon, the energy of which is equal to the energy difference of the two orbitals involved. Thus, the material emits radiation, which has energy characteristic of the atoms present. The term fluorescence is applied to phenomena in which the absorption of radiation of a specific energy results in the re-emission of radiation of a different energy (generally lower).

* Source : wikipedia.org


XRF for EMI solution



Resistance Compression Test (ESQ-517-27)

Resistance Compression Test for EMI shielding
  • Electrode plate size : 25mm x 50mm x 10mm
  • Electrode material : Gold plated copper
  • measuring range : 0.1μΩ ~ 110MΩ
  • Sample size : L50mm (Standard specimen size of fingerstock : 1~3pins)
Test method

The sample is inserted between electrode plates, and the upper plate is pressed down to measure vertical stress resistance, force exerted, and compression rate. The test returns the best fitting compression rate for each sample.


Resistance Compression Test for EMI shielding

Test object

Thick and flexible products such as fabric over foam and fingerstock

Test sample size : 1.0mm ~ 30mm think and 50mm long




EMI Shielding Performance Test

ASTM D4935

EMI Shielding Performance Test
  • Measured range : 30MHz~1GHz
  • Sample size : D130mm
Test mothod

The sample sheet(O.D. 130mm, I.D. 70mm) is inserted between the shielded chamber, and S.E. through the sample sheet is measured with network analyzer. Shielding effectiveness is computed by comparing shielded S.E. intensity with control S.E. intensity.


EMI Shielding Performance Test

Test object

Products less than 2mm thick such as conductive fabric, conductive mesh, conductive film and conductive tape


Advantest

EMI Shielding Performance Test
  • Measured range : 10MHz~1GHz
  • Samle size : 150mm x 55mm
Test method

The same method as MIL-DTL-83528C; available from the frequency of 10KHz.


EMI Shielding Performance Test

Test object

Conductive mesh, conductive film, comductive thin sheet, miliraty-used shielding material


ESQ-517-28 (MIL-DTL-83528C equivalent)

EMI Shielding Performance Test
  • Measured range : 100MHz~6GHz
  • Sample size : 400mm x 400mm
Test method

For measuring wide range frequency


EMI Shielding Performance Test

Test object

Fabric over foam, fingerstock, wire mesh gasket, bigger product




Surface Resistance Test (ESQ-517-04)

*Refer to ASTM D257-99

EMI Shielding Performance Test
  • Measured range : 30mΩ~30KΩ
  • Sample size : 50mm x 50mm
Test method
EMI Shielding Performance Test

test object

Conductive fabric, conductive non-woven, conductive adhesive tape, conductive thin sheet




Volume Resistance Test (MIL-DTL-83528C(ASTM D991-Low Resistance Domain), ASTM D257)

EMI Shielding Performance Test
  • Measuring range : 30mΩ~30KΩ
  • sample size : 50mm x 50mm
  • Electrode weight : 200g~240g
Test method

Put down the sample on the insulation plate and put electrode on the center of sample and measure resistance


EMI Shielding Performance Test

Test object

Products which is electrically conductive itself such as conductive silicone elastomer and conductive foam




Compression Recovery Test (ESQ-517-26)

EMI Shielding Performance Test
  • Cycling speed : Max 4cycle/sec
  • Pressing material : stainless steel
Test method

This is to test its life cycle concerning restoration. put the sample on the lower die and compress cycle/sec to 30% of its free standing height


EMI Shielding Performance Test

Test ocject

Products where recovery rate is important, such as fabric over foam gaskets and fingerstock




Magnetic Shielding Performance Test (ASTM A698-92)

EMI Shielding Performance Test
  • Frequency range : 10Hz~10KHz
  • Measuring range : 0.1mG~10G
  • Sample size(D/4) : Φ250mmX300mm
  • Sample shape : cylinder
Test method

Put the sample in the center of the Helmholtz coil and generate an alternating magnetic field to sample. Magnetic shielding effectiveness(S) is expressed as below formula, which means the difference between the strength(Be) of the magnetic field measured without shielding material and the strength(Bi) measured covered.


EMI Shielding Performance Test

Test object

Products which has permeability such as permalloy foil, MAGshiel foil, Si-steel. etc.




Thermal Conductivity Test

Thermal Conductivity Test
  • Thermal Conductivity Measurement: 0.1W/mK ~ 100W/mK
  • Thermal resistance measuring range: 0.01K/W ~ 8K/W
  • Measurable material: Solid, Powder, Liquid
  • Measurable thickness: 50㎛ ~ 20mm
  • Measuring pressure: 10psi ~ 150psi (Possible to measure thickness and thermal resistance of specimen under pressure changes)

Principle of operation

This thermal conductivity measuring instrument can measure the thermal conductivity of various materials by using the thermal equilibrium method according to the US ASTM D5470 standard. This device measures the thermal conductivity of the specimen at the moment when the heat quantity in the upper and lower parts becomes equilibrium.




Lead wettability measurement

Lead wettability measurement
  • Usage:
  • Evaluation and measurement of wettability of solder on electronic parts

    Measures wetting time, wetting force, contact angle and surface tension

  • Specification: penetration depth 0.01 ~ 20.0mm
  • Penetration rate: 0.1 ~ 30.0mm / sec
  • Dimensions: 467 (W) * 475 (D) * 556 (H) mm
  • Pressure sensitivity: 50mN full-scale
  • Bath temperature: 245℃ ± 2℃, PID control

Principle of operation

The sample is hung on the arm of the electronic balance and automatically penetrates the solder melted up to the set depth by the set speed. At this time, the molten lead is adsorbed on the surface of the electronic component according to the interfacial tension acting on the electronic component lead's surface, forming a contact angle. This change is transferred to the electronic balance hanging from the electronic component sample. By measuring the transferred force, it is possible to continuously obtain changes in the molten lead's adsorption force and contact angle over time. From this information, various data, such as wetting, contact angle, and surface tension, are calculated by a computer using a data processing program.




Ageing Test (ESQ-517-20)

Ageing Test
Test method

It is one of the most popular reliability tests. Raise the temperature and humidity rapidly to sample and keep for some time. Observe its shape, conductivity, adhesion, and restoration and compare it with its initial status. The test conditions, time, temperature, and humidity are matched to the size and type of the sample.




Plating Adhesion Strength Test (ESQ-517-16)

Sample size

W50mm X L50mm


Test method

Put the sample on the rubber mat. Attach high adhesion transparent tape (3M600) on the sample and press it ten times with a 2Kg weight roller smoothly back and forth. Remove the tape from the sample slowly. Compare the amount of plating material on the tape's adhesive with the adhesion standard of plating metal shown below. Rate it from Grade 1 to Grade 5. (Grade 5 is the best, and Grade 1 is the worst.)

Plating Adhesion Strength Test


EX)

Plating Adhesion Strength Test

Test object

Conductive fabric