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Overview
- RF/EMI shielding conductive cushion pad is made of cushion material such as a sponge, non-woven fabric, or conductive foam, and has excellent RF/EMI shielding effectiveness due to excellent electrical horizontal and vertical conductivity.
- Depending on the materials, this product could be used as a sealing material from dust.
- Easy to process with various shape punching.
Features
- Excellent horizontal/vertical (XYZ directions) conductivity.
- Excellent electrical conductivity due to Cu/Ni plating on polyolefin, non-woven fabric, and sponge.
- Various uses such as noise shielding, grounding, I/O gasket, etc.
- RoHS Compliant
Details
Polyolefin Pad Type
- Useful for shielding radio waves directed to the surface or as a thin grounding part (Care must be taken when shielding radio waves passing to the side)
- It is made of polyolefin (closed-cell foam) to achieve a thin design, and can conduct vertical electricity through a vertical pinhole (via-hole).
- Can be used for multiple purposes such as noise shielding, grounding, and I/O gasket, and is easy to process into a punched shape.
- Option: Conductive adhesive lamination available
- Available sizes
- Thickness: 0.2mm, 0.3mm, 0.4mm, 0.5mm, 0.6mm, 0.7mm, 0.8mm, 0.9mm, 1mm
- Length: 50m/roll
- Width: 1,000mm
| Contents | Unit | PD518NF-PEF-0030 | PD518NF-PEF-0050 | PD518NF-PEF-0070 | PD518NF-PEF-0080 | PD518NF-PEF-0100 | Test Method |
|---|---|---|---|---|---|---|---|
| Thickness | mm | 0.3±0.1 | 0.5±0.1 | 0.7±0.1 | 0.8±0.1 | 1.0±0.2 | ASTM D1777 |
| Weight | g/m² | 90±10 | 115±10 | 124±10 | 128±10 | 178±10 | ASTM D3776 |
| Width | mm | 1050±20 | 1050±20 | 1000±20 | 1050±20 | 1000±20 | |
| Surface resistance | Ω/□ | < 0.08 | < 0.08 | < 0.08 | < 0.08 | < 0.08 | MIL-G-83528 |
| Vertical resistance | Ω | < 0.03 | < 0.03 | < 0.03 | < 0.03 | < 0.03 | MIL-G-83528 |
Sponge-Mesh Type
- It is a cushion pad composed of conductive sponge (open-cell foam) and conductive mesh (reinforcement carrier) and is conductive in the XYZ direction.
- Can be used for multiple purposes such as noise shielding, grounding, and I/O gasket, and is easy to process into a punched shape.
- If excessively pressurized, the plating particles may fall, so there is a risk of short circuit and deterioration of resilience when used directly on the PCB.
- Option: Conductive adhesive lamination available
- Available sizes
- Thickness: 0.3mm, 0.5mm, 0.7mm, 1mm, 1.5mm, 2mm, 2.5mm, 3mm, 3.5mm, 4mm, 4.5mm, 5mm
- Length: 50m/roll (0.3~2.5mmT), 30m/roll (3~4.5mmT), 20m/roll (5mmT)
- Width: 1,000mm
Nonwoven-Sponge-Mesh Type
- It is a cushion pad composed of conductive non-woven fabric (particle avoidance), conductive sponge (open-cell foam), and conductive mesh (reinforcement carrier), and is conductive in the XYZ direction.
- It can be used for multiple purposes such as noise shielding, grounding, and I/O gasket, and is easy to process into a punched shape.
- There is no risk of generating plating particles and it has good resilience even after long-term pressurization, making it useful for equipment that requires a high shielding ratio.
- Option: Conductive adhesive lamination available
- Available sizes
- Thickness: 1mm (1.1mm when conductive adhesive treatment; excluding release paper)
- Length: 25m/roll
- Width: 560mm
Applications
It could be installed where conductivity and cushion are needed inside electronic devices like LCD TV, monitor, smartphone, game machine, and connectors to secure excellent electromagnetic noise shielding effectiveness.
Product Support
Product Number
| Number | Code | Example |
|---|---|---|
| (1) | Product Code | PD (Cushion Pad) |
| (2) | Serial Number | 5161 |
| (3) | Flame Retardant | NF: Non Flame Retardant, FR: Flame Retardant |
| (4) | Cushion Material | CSP: Conductive sponge, PEF: Conducive polyolefin, CNW: Conductive non-woven |
| (5) | Thickness | 0200: 2.0mm |
| (6) | Adhesive Lamination | CP: Conductive adhesive, NP: No adhesive |
Documentation
No data.