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Contents | Unit | Data | Test Methods |
---|---|---|---|
Thickness | mm | 0.15 ~ 0.05 | |
Thermal Conductivity | W/mK | > 2.5 | ASTM D 5470 |
Hardness | Shore A | 75±10 | ASTM D 2240 |
Density | g/㎤ | 2.6±0.15 | ASTM D 792 |
Dielectric breakdown strength | KV/mm | > 10 | ASTM D 149 |
Volume resistance | Ω-㎝ | > 1*1012 | ASTM D 257 |
Tensile strength | kgf/cm2 | > 25 | ASTM D 412 |
Product Number | Color | Thickness [mm] |
Hardness | Thermal Conduc- tivity[W/mK] |
Tempera-ture[˚C] | Volume resistance [Ω.m] |
||
---|---|---|---|---|---|---|---|---|
Soft Type | TH708S-40-15-OO | Gray,White | 0.5~10 | Shore OO | 40~60 | 1.5 | -60~200 | Min.1.0x10 |
TH709S-60-20-OO | 60~80 | 2.0 | Min.3.0x10 | |||||
TH710S-80-30-OO | 70~90 | 3.0 | Min.3.0x10 | |||||
TH709S-60-20-GF | 0.3~5 | 60~80 | 1.7 | Min.3.0x10 | ||||
TH710S-80-30-GF | 70~90 | 2.5 | Min.3.0x10 | |||||
TH710S-80-30-PM | 70~90 | 2.8 | -60~180 | Min.3.0x10 | ||||
TH711S-20-10-PF | 0.5~8 | 2~10 | 1.0 | -60~200 | Min.1.0x10 | |||
TH732S-20-10-OO | 20~40 | 1.0 | Min.1.0x10 | |||||
TH714S-40-10-OO | 30~50 | 1.0 | Min.1.0x10 | |||||
TH711S-20-10-GF | 0.3~5 | 2~10 | 1.0 | Min.1.0x10 | ||||
TH714S-40-10-GF | 40~60 | 0.9 | Min.5.0x10 | |||||
TH708S-40-15-GF | 50~70 | 1.3 | Min.7.0x10 | |||||
Hard Type | TH718S-80-12-OO | Gray | 0.2,0.4,0.6 | Shore A | 75 | 1.12 | -60~180 | 3.0x10 |
TH719S-85-17-OO | Brown | 85 | 1.7 | 2.0x10 | ||||
TH720S-80-27-OO | Blue | 80 | 2.6 | 8.0x10 | ||||
TH721S-50-10-OO | Black | 55 | 1.1 | 5.0x10 | ||||
TH712S-90-09-GF | Gray | 0.18,0.23,0.30 | 90 | 0.9 | 1.0x10 | |||
TH722S-90-16-GF | Pink | 92 | 1.5 | 1.0x10 | ||||
TH723S-90-20-GF | Pink | 88 | 2.0 | 1.0x10 | ||||
TH724S-90-30-GF | Blue | 85 | 2.5 | 1.0x10 |
Easy to work because it is soft and adhesive and it can be easily attached, detached and fixed. Mainly attached on the PCB board and the heat source.
In particular, ultra-thin thermal sheet has good elasticity and flexibility, and is easy to adhere to other materials such as copper foil and non-woven fabric, and can be manufactured in various shapes according to the shape of a mother cell or the like and has excellent adhesiveness to maximize heat conduction performance.
* Source: https://gigglehd.com/gg/mobile/4483900