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SMF01 | SMF02 | SMF03 | |
---|---|---|---|
Recommended size | 3.0~25.0mm thick | 0.5~3.0mm thick | 3.0~25.0mm thick |
Outer layer | Conductive PI film | Conductive metal layer | Heat-resistant conductive PI film |
Core | Heat-resistant PU sponge | Silicone rubber | Heat-resistant PU sponge |
Operating temperature | -40~+105℃ | -40~+125℃ | -40~+125℃ |
Z-axis resistance | < 0.1Ω | < 0.1Ω | < 0.1Ω |
Compression recovery rate | > 90% | > 90% | > 90% |
Features | - Soft material used - Suitable for home appliance |
- Ultra-small sized gasket - Suitable for small devices like mobile |
- Heat-resistant material used - Suitable for automotive components |
Properties | Unit | Typical Value | Remarks | |
---|---|---|---|---|
Z-axis resistance | Before mount | Ω | < 0.1Ω | ESQ-612-02 |
After mount | Ω | < 0.1Ω | ESQ-612-02 | |
Compression recovery rate | % | > 90% | ESQ-612-26 | |
Recommended compression rate | % | 20% | ESQ-612-27 | |
Solder adhesion strength | gf | > 500 | ESQ-612-36 | |
Reflow temperature | ℃ | 230~260 | Peak : Max. 10 sec. | |
Operating temperature | ℃ | -40~+105/+125 | SMF01: Max. +105℃ SMF02/03: Max. +125℃ |
|
Flame retardancy | UL94 V-0 |
SMF01 / SMF03 | ||||
---|---|---|---|---|
Material | Surface | Conductive PI film | ||
Core | PU sponge | |||
Size (mm) |
- | W | T(X) | L |
Max. | 12.0 | 20.0 | ~ | |
Min. | 3.0 | 1.5 | 2.5 |
# | Code | Explanation |
---|---|---|
(1) | Product code | SMF (Surface Mount) |
(2) | Series | 01: Sponge, 02: Silicone, 03: Heat-resistant |
(3),(4),(5) | W, T, L | 050: 5.0mm, 030: 3.0mm, 040: 4.0mm |