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Contents | Unit | Value | Remarks |
---|---|---|---|
Electric Resistance | Ω | < 0.1 | ESQ-612-02 |
Compression Recovery Rate | % | > 90 | ESQ-612-26 |
Compression Rate | % | 20~25 | ESQ-612-27 |
Flame Retardant | - | UL94 V0 | UL File# E221431 |
Aging Test (After aging) | % | > 90 | 20% Comp., 70℃, 100hr |
Solder Joint Strength | kgf | > 0.5 | - |
Reflow Temperature | ℃ | 230~260 |
Peak Time: Max. 10sec |
Repulsive Force | kgf | < 1 | ESQ-612-27 |
Operating Temperature | ℃ | -40~85 |
|
Environmental Regulation | N999P033 Compliant, Lead free |
Feature | ||||
---|---|---|---|---|
Material | Surface | Conductive film | ||
Adhesive | Eco-friendly adhesive | |||
Core | Heat resistant sponge (reflowable to 260℃) | |||
Size(mm) | Width | Height | Length | |
Max. | 12 | 20 | ~ | |
Min. | 3.5 | 1.0 | 2.5 |
(unit:mm)
Gasket Size | PCB Landing | Metal Mask Thickness | ||||
---|---|---|---|---|---|---|
W | L | PW | PL | SW | SG | |
4 | 3 | 4.5 | 3.2 | 1.5 | 1.5 | 0.15 |
5 | 3 | 5.5 | 3.2 | 2 | 1.5 | 0.15 |
5 | 4 | 5.5 | 4.2 | 2 | 1.5 | 0.15 |
8 | 8 | 8.5 | 8.2 | 3 | 2.5 | 0.15 |
SMT Gasket | Finger Strip | |
---|---|---|
Compression Recovery Rate | > 90% / High | 85 ~ 90% / Low |
Surface Resistance | < 0.1 / Low | < 0.1 / Low |
Contact Area | Surface | Point / Line |
Environmental Regulation | RoHS Complaint, Halogen Free | BeCu Banned |
Number | Code | Example |
---|---|---|
(1) | Product Code | SMF (Surface Mount Foam) |
(2) | Serial Number | 01 |
(3) | Width (W) | 050: 5.0mm |
(4) | Height (H) | 030: 3.0mm |
(5) | Length (L) | 040: 4.0mm |
(6) | Shape | T Shape |